Fahimeh Emadi

affiliation not provided to SSRN

Learn more about SSRN Profiles

SCHOLARLY PAPERS

1

DOWNLOADS

38

TOTAL CITATIONS

0

Feedback

Scholarly Papers (1)

Sort by:

Actions:

View:
Selected
Original List
All Versions Hide All Versions
All Abstracts Hide All Abstracts

(Rank)

1.

Microstructural and Mechanical Characterization of Cu/Sn Slid Bonding Utilizing Co as Contact Metallization Layer

Number of pages: 29 Posted: 28 Jun 2022

Fahimeh Emadi, Vesa Vuorinen, Stefan Mertin, Kim Widell and Mervi Paulasto-Kröckel

affiliation not provided to SSRN, Aalto University, affiliation not provided to SSRN, affiliation not provided to SSRN and Aalto University

Downloads 38 (1,209,354)

Abstract:

Feedback

All content on this site: Copyright © 2026 Elsevier Inc., its licensors, and contributors. All rights are reserved, including those for text and data mining, AI training, and similar technologies. For all open access content, the relevant licensing terms apply.

We use cookies to help provide and enhance our service and tailor content.

To learn more, visit .