Vesa Vuorinen

Aalto University

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SCHOLARLY PAPERS

2

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Scholarly Papers (2)

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1.

Low-Temperature Wafer-Level Bonding with Cu-Sn-In Solid Liquid Interdiffusion for Microsystem Packaging

Number of pages: 24 Posted: 31 Oct 2023

Obert Golim, Vesa Vuorinen, Tobias Wernicke, Marta Pawlak and Mervi Paulasto-Kröckel

Aalto University, Aalto University, affiliation not provided to SSRN, affiliation not provided to SSRN and Aalto University

Downloads 46 (1,121,190)

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2.

Microstructural and Mechanical Characterization of Cu/Sn Slid Bonding Utilizing Co as Contact Metallization Layer

Number of pages: 29 Posted: 28 Jun 2022

Fahimeh Emadi, Vesa Vuorinen, Stefan Mertin, Kim Widell and Mervi Paulasto-Kröckel

affiliation not provided to SSRN, Aalto University, affiliation not provided to SSRN, affiliation not provided to SSRN and Aalto University

Downloads 38 (1,209,354)

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