Marta Pawlak

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Low-Temperature Wafer-Level Bonding with Cu-Sn-In Solid Liquid Interdiffusion for Microsystem Packaging

Number of pages: 24 Posted: 31 Oct 2023

Obert Golim, Vesa Vuorinen, Tobias Wernicke, Marta Pawlak and Mervi Paulasto-Kröckel

Aalto University, Aalto University, affiliation not provided to SSRN, affiliation not provided to SSRN and Aalto University

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