Obert Golim

Aalto University

P.O. Box 21210

Helsinki, 00101

Finland

Learn more about SSRN Profiles

SCHOLARLY PAPERS

1

DOWNLOADS

46

TOTAL CITATIONS

0

Feedback

Scholarly Papers (1)

Sort by:

Actions:

View:
Selected
Original List
All Versions Hide All Versions
All Abstracts Hide All Abstracts

(Rank)

1.

Low-Temperature Wafer-Level Bonding with Cu-Sn-In Solid Liquid Interdiffusion for Microsystem Packaging

Number of pages: 24 Posted: 31 Oct 2023

Obert Golim, Vesa Vuorinen, Tobias Wernicke, Marta Pawlak and Mervi Paulasto-Kröckel

Aalto University, Aalto University, affiliation not provided to SSRN, affiliation not provided to SSRN and Aalto University

Downloads 46 (1,121,190)

Abstract:

Feedback

All content on this site: Copyright © 2026 Elsevier Inc., its licensors, and contributors. All rights are reserved, including those for text and data mining, AI training, and similar technologies. For all open access content, the relevant licensing terms apply.

We use cookies to help provide and enhance our service and tailor content.

To learn more, visit .