263 Kaiyuan Ave, Luolong Qu
Luoyang Shi
China
Henan University of Science and Technology
Metal-matrix composites, Interface/interphase, Microstructures, Electron microscopy
Cu/Al2Cu/Al system, Molecular Dynamics simulations, Cooling
C18150 Cu/1060 Al composites, Interface evolution, Nano-particles, Properties
Cu/Al composites, intermetallic compounds, microstructure, strengthening and toughening mechanisms
Cu-Zr/Al laminated composite, Molecular dynamics simulation, Tensile fracture
high strength and high conductivity, Cu/Al laminated composites, microstructure
Dual-scale SiCp, A356 alloy, Interfacial microstructure, Strengthening mechanism, In situ transmission tensile test