263 Kaiyuan Ave, Luolong Qu
Luoyang Shi
China
Henan University of Science and Technology
C18150 Cu/1060 Al composites, Interface evolution, Nano-particles, Properties
high strength and high conductivity, Cu/Al laminated composites, microstructure
Dual-scale SiCp, A356 alloy, Interfacial microstructure, Strengthening mechanism, In situ transmission tensile test