1037 Luoyu Rd
Wuhan, 430074
China
Huazhong University of Science and Technology
Ultrasonic vibration cutting, Laser assisted cutting, Ductile machining, Micro-structures, Subsurface damage.
Material removal model, Eccentric shaft machining, Ultrasonic elliptical vibration cutting, Microstructural evolution, Subsurface damage
Laser ablation, self-maintaining graphitization, laser-induced damage, semi-transparent model, opaque model
molecular dynamics simulation, elliptical vibration cutting, single-crystal silicon, crystal defects, subsurface damage
Single crystal diamondIon beam angled etchingArgon-oxygen mixtureInverted cone angleFormation mechanismStructural accuracy
Reaction-bonded silicon carbide, Interfaces, Deformation and fracture, Cross slips, Crack propagation
Micro/nano structures, Anti-reflection, Superhydrophobicity, Femtosecond laser, durability
elastic metamaterials, vibration mitigation, Bandgap characteristics, multi-frequency, broadband vibration attenuation