No.79 West Yingze Street
Taiyuan
China
Taiyuan University of Technology
Diamond film, W substrate, Deposition temperature, Thermal conductivity, adhesion Strength, Thermal shock
Ti6Al4V alloy, Diamond particles, Ni-based composite coatings, Impact properties, Dry-sliding tribological properties
Polycrystalline diamond (PCD), Chemomechanical abrasive polishing (CMAP), Material removal rate (MRR), Surface roughness, SiO2-diamond slurry, Removal mechanism of diamond material
Chemomechanical abrasive polishing (CMAP), Material removal rate (MRR), Surface morphology and roughness, Mechanical, chemical mechanism and bubble cavitation
Ti6Al4V alloy, Cu-Sn-Ti alloy, Diamond particles, Cu-based composite coating, Vacuum cladding, Dry-sliding tribological properties
polycrystalline diamond (PCD), Chemomechanical abrasive polishing (CMAP), material removal rate (MRR), surface roughness, SiO2-diamond slurry, Removal mechanism of diamond material
Ti6Al4V alloy, Composite particle-reinforced coating, Vacuum cladding, Dry-sliding tribological properties