No.79 West Yingze Street
Taiyuan
China
Taiyuan University of Technology
Diamond film, W substrate, Deposition temperature, Thermal conductivity, adhesion Strength, Thermal shock
Polycrystalline diamond (PCD), Chemomechanical abrasive polishing (CMAP), Material removal rate (MRR), Surface roughness, SiO2-diamond slurry, Removal mechanism of diamond material
Chemomechanical abrasive polishing (CMAP), Material removal rate (MRR), Surface morphology and roughness, Mechanical, chemical mechanism and bubble cavitation
Single crystal Diamond, TiZrNbTa HEA coating, Magnetron Sputtering, Solderability, Shear fracture mode
Ti6Al4V alloy, Cu-Sn-Ti alloy, Diamond particles, Cu-based composite coating, Vacuum cladding, Dry-sliding tribological properties
polycrystalline diamond (PCD), Chemomechanical abrasive polishing (CMAP), material removal rate (MRR), surface roughness, SiO2-diamond slurry, Removal mechanism of diamond material