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Yan Hong

affiliation not provided to SSRN

  • affiliation not provided to SSRN

SCHOLARLY PAPERS

7

DOWNLOADS

281

TOTAL CITATIONS

1

Scholarly Papers (7)

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1.

Preventing Anode Degradation Through Copper Foil Surface Modification Techniques for Lithium-Ion Batteries

Number of pages: 25 Posted: 20 Dec 2024
Chong Wang, Lingfen Wu, Yan Hong, Yanhua Zhang, Shouxu Wang, Guoyun Zhou, Zesheng Wen, Wei He, Haiya Han and Yongqiang Xu
affiliation not provided to SSRN, affiliation not provided to SSRN, affiliation not provided to SSRN, Xichang University, affiliation not provided to SSRN, University of Electronic Science and Technology of China (UESTC), affiliation not provided to SSRN, Sichuan Normal University, affiliation not provided to SSRN and affiliation not provided to SSRN
Downloads 60 (961,006)

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Lithium-ion batteries, Copper foil, current collectors, Surface modification, adhesion

2.

Rhodium-activated electroless plating for copper deposition on epoxy resin substrate

Number of pages: 18 Posted: 05 Feb 2025
Guoyun Zhou, Qian Huang, Zhipeng Li, Yan Hong, Shouxu Wang, Jiujuan Li, Chong Wang, Wei He, Zhijie Liang, Huan Xu and Zhiwei Han
University of Electronic Science and Technology of China (UESTC), affiliation not provided to SSRN, affiliation not provided to SSRN, affiliation not provided to SSRN, affiliation not provided to SSRN, affiliation not provided to SSRN, affiliation not provided to SSRN, Sichuan Normal University, affiliation not provided to SSRN, affiliation not provided to SSRN and affiliation not provided to SSRN
Downloads 49 (1,074,648)

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Electroless copper plating, Surface modification, Rhodium, Organometallic compound

3.

Fabrication and Characterization of Nano-Zno/Cnts/Pdms Flexible Pressure Sensor

Number of pages: 16 Posted: 24 Feb 2023
Yuanming Chen, Jiaqi Li, Yan Hong, Wei He, Yao Tang, Guoyun Zhou, Zhenlin Xu, Yaozong He, Zhiguo Nie and Shouxu Wang
Sichuan Normal University, affiliation not provided to SSRN, affiliation not provided to SSRN, Sichuan Normal University, affiliation not provided to SSRN, University of Electronic Science and Technology of China (UESTC), affiliation not provided to SSRN, affiliation not provided to SSRN, affiliation not provided to SSRN and affiliation not provided to SSRN
Downloads 48 (1,086,013)

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CNTs, nano-ZnO, PDMS, Flexible pressure sensor

4.

Uv-Induced Graft Polymerization of Polyamide-6 for Electroless Copper Deposition

Number of pages: 25 Posted: 21 Apr 2023
Yuanming Chen, Shaorong Liang, Wei He, Shouxu Wang, Chong Wang, Zhuoming Du, Yongjie Du, Weiguo Yang, Binyun Liu and Yan Hong
Sichuan Normal University, affiliation not provided to SSRN, Sichuan Normal University, affiliation not provided to SSRN, affiliation not provided to SSRN, affiliation not provided to SSRN, affiliation not provided to SSRN, affiliation not provided to SSRN, affiliation not provided to SSRN and affiliation not provided to SSRN
Downloads 47 (1,097,529)

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UV irradiation, Polyamide-6, Graft polymerization, Electroless copper deposition, Metal patterns

5.

Electroless Copper Plating on Pet Fibers Through One-Step Pretreatment Involving Spin Structure with Silver Nanoparticles

Number of pages: 14 Posted: 03 Apr 2025
Binbin Zhang, Yuanhao Liu, Guorui Mou, Zhijie Liang, Chong Wang, Guoyun Zhou, Jiujuan Li, Zesheng Wen, Yongqiang Xu, Jianhui Li, Yan Hong and Wei He
affiliation not provided to SSRN, affiliation not provided to SSRN, affiliation not provided to SSRN, affiliation not provided to SSRN, affiliation not provided to SSRN, University of Electronic Science and Technology of China (UESTC), affiliation not provided to SSRN, affiliation not provided to SSRN, affiliation not provided to SSRN, affiliation not provided to SSRN, affiliation not provided to SSRN and Sichuan Normal University
Downloads 31 (1,304,549)

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Electroless plating, PET fibers, AgNPs, SPIN Structure, Wearable electronics

6.

Chemically Activated Ag-Embedded Bridged-Layer for Copper Pattern Addition on Pet Film

Number of pages: 20 Posted: 12 Dec 2023
Guoyun Zhou, Xiongyao Li, Jiujuan Li, Shouxu Wang, Ying Yang, Chong Wang, Yan Hong, Yuanming Chen, Zhiwei Han and Zhipeng Li
affiliation not provided to SSRN, affiliation not provided to SSRN, affiliation not provided to SSRN, affiliation not provided to SSRN, affiliation not provided to SSRN, affiliation not provided to SSRN, affiliation not provided to SSRN, Sichuan Normal University, affiliation not provided to SSRN and affiliation not provided to SSRN
Downloads 28 (1,345,526)
Citation 1

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Flexible electronics, Surface interface；Chemical activation；Electroless copper plating.

7.

Modified Anthraquinone as a Bifunctional Leveler in Acid Copper Electroplating for Advanced Interconnects

Number of pages: 27 Posted: 17 Mar 2026
Chong Wang, Haoning Zhang, Yuehui Zhai, Jiujuan Li, Shouxu Wang, Yan Hong, Guoyun Zhou, Guoxing Xu and Yuxi Sun
affiliation not provided to SSRN, affiliation not provided to SSRN, affiliation not provided to SSRN, affiliation not provided to SSRN, affiliation not provided to SSRN, affiliation not provided to SSRN, University of Electronic Science and Technology of China (UESTC), affiliation not provided to SSRN and affiliation not provided to SSRN
Downloads 18 (1,470,786)

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organic additives, redox couple, Anthraquinone derivative, throwing power, copper interconnects