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Huan Xu

affiliation not provided to SSRN

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Rhodium-activated electroless plating for copper deposition on epoxy resin substrate

Number of pages: 18 Posted: 05 Feb 2025
Guoyun Zhou, Qian Huang, Zhipeng Li, Yan Hong, Shouxu Wang, Jiujuan Li, Chong Wang, Wei He, Zhijie Liang, Huan Xu and Zhiwei Han
University of Electronic Science and Technology of China (UESTC), affiliation not provided to SSRN, affiliation not provided to SSRN, affiliation not provided to SSRN, affiliation not provided to SSRN, affiliation not provided to SSRN, affiliation not provided to SSRN, Sichuan Normal University, affiliation not provided to SSRN, affiliation not provided to SSRN and affiliation not provided to SSRN
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Electroless copper plating, Surface modification, Rhodium, Organometallic compound