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Taiqiang Wang

affiliation not provided to SSRN

  • affiliation not provided to SSRN

SCHOLARLY PAPERS

2

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136

TOTAL CITATIONS

3

Scholarly Papers (2)

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1.

24.18% Efficiency Topcon Solar Cells Enabled by Super Hydrophilic Carbon-Doped Polysilicon Films Combined with Plated Metal Fingers

Number of pages: 17 Posted: 11 Mar 2023
Haojiang Du, Taiqiang Wang, Wei Liu, Yali Ou, Mengchao Xing, Weiguang Yang, Jiang Sheng, Mingdun Liao, Zhijie Gu, Baojie Yan, Zhenhai Yang, Yuheng Zeng and Jichun Ye
affiliation not provided to SSRN, affiliation not provided to SSRN, Chinese Academy of Sciences (CAS) - Ningbo Institute of Materials Technology and Engineering, affiliation not provided to SSRN, affiliation not provided to SSRN, Shanghai University, Chinese Academy of Sciences (CAS) - Ningbo Institute of Materials Technology and Engineering, affiliation not provided to SSRN, Tokyo University of Agriculture and Technology, affiliation not provided to SSRN, Chinese Academy of Sciences (CAS) - Ningbo Institute of Materials Technology and Engineering, Chinese Academy of Sciences (CAS) - Ningbo Institute of Materials Technology and Engineering and Chinese Academy of Sciences (CAS) - Ningbo Institute of Materials Technology and Engineering
Downloads 76 (830,555)

Abstract:

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carbon-doped polysilicon, TOPCon, copper electroplating, metallization, surface wettability, super hydrophilic

2.

Advancing Nickel Seed Layer Electroplating for Enhanced Contact and Passivation Performance in Topcon Solar Cells

Number of pages: 17 Posted: 20 May 2024
Mengchao Xing, Taiqiang Wang, Fangfang Cao, Haojiang Du, Mingdun Liao, Wei Liu, Feng Li, Chuanxiao Xiao, Wenrui Zhang, Zhenhai Yang, Yuheng Zeng and Jichun Ye
affiliation not provided to SSRN, affiliation not provided to SSRN, affiliation not provided to SSRN, affiliation not provided to SSRN, affiliation not provided to SSRN, Chinese Academy of Sciences (CAS) - Ningbo Institute of Materials Technology and Engineering, affiliation not provided to SSRN, affiliation not provided to SSRN, Chinese Academy of Sciences (CAS) - Ningbo Institute of Materials Technology and Engineering, Chinese Academy of Sciences (CAS) - Ningbo Institute of Materials Technology and Engineering, Chinese Academy of Sciences (CAS) - Ningbo Institute of Materials Technology and Engineering and Chinese Academy of Sciences (CAS) - Ningbo Institute of Materials Technology and Engineering
Downloads 60 (989,921)
Citation 3

Abstract:

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Keywords: Electroplating, TOPCon, nickel seed layer, contact resistivity, low-temperature process