Fangfang Cao

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Advancing Nickel Seed Layer Electroplating for Enhanced Contact and Passivation Performance in Topcon Solar Cells

Number of pages: 17 Posted: 20 May 2024
Mengchao Xing, Taiqiang Wang, Fangfang Cao, Haojiang Du, Mingdun Liao, Wei Liu, Feng Li, Chuanxiao Xiao, Wenrui Zhang, Zhenhai Yang, Yuheng Zeng and Jichun Ye
affiliation not provided to SSRN, affiliation not provided to SSRN, affiliation not provided to SSRN, affiliation not provided to SSRN, affiliation not provided to SSRN, Chinese Academy of Sciences (CAS) - Ningbo Institute of Materials Technology and Engineering, affiliation not provided to SSRN, affiliation not provided to SSRN, Chinese Academy of Sciences (CAS) - Ningbo Institute of Materials Technology and Engineering, Chinese Academy of Sciences (CAS) - Ningbo Institute of Materials Technology and Engineering, Chinese Academy of Sciences (CAS) - Ningbo Institute of Materials Technology and Engineering and Chinese Academy of Sciences (CAS) - Ningbo Institute of Materials Technology and Engineering
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Keywords: Electroplating, TOPCon, nickel seed layer, contact resistivity, low-temperature process