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Yunxiao Tai

Hefei University of Technology

193 Tunxi Rd

Baohe

Hefei

China

  • Hefei University of Technology

SCHOLARLY PAPERS

2

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63

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0

Scholarly Papers (2)

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1.

Microstructural Evolution of Graded W-Cu Materials Under Repeated Thermal Shocks

Number of pages: 21 Posted: 22 Mar 2023
Bangzheng Wei, Guang Yang, Yunxiao Tai, Dang Xu, Ruizhi Chen, Rui Zhou, Pengqi Chen, Q. Xu and Jigui Cheng
Hefei University of Technology, Hefei University of Technology, Hefei University of Technology, Hefei University of Technology, Hefei University of Technology, Hefei University of Technology, Hefei University of Technology, Kyoto University - Institute for Integrated Radiation and Nuclear Science and Hefei University of Technology
Downloads 47 (1,109,210)

Abstract:

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W-Cu alloys, Continuously functional graded materials, Thermal shock, Microstructural evolution.

2.

Multi-Factor Coupled Failure Mechanism of W-Cu Functionally Graded Material Under Thermal Shock Service

Number of pages: 28 Posted: 19 Sep 2023
Pengqi Chen, Dang Xu, Chengyang Huang, Jian Yang, Yunxiao Tai, Tao Hong, Jigui Cheng and Hongyu Chen
Hefei University of Technology, Hefei University of Technology, Hefei University of Technology, Hefei University of Technology, Hefei University of Technology, Hefei University of Technology, Hefei University of Technology and Zhejiang University of Technology
Downloads 16 (1,500,778)

Abstract:

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W-Cu FGM, Thermal shock, Failure mechanism, Microcrack