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Tao Hong

Hefei University of Technology

193 Tunxi Rd

Baohe

Hefei

China

  • Hefei University of Technology

SCHOLARLY PAPERS

5

DOWNLOADS

93

TOTAL CITATIONS

0

Scholarly Papers (5)

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1.

Connection Reinforcement Design of W-Cu Joint: Transforming Immiscible Interface into Dual Reaction Diffusion Interface

Downloads 32 (1,304,549)

Connection Reinforcement Design of W-Cu Joint: Transforming Immiscible Interface into Dual Reaction Diffusion Interface

Number of pages: 45 Posted: 31 Oct 2024
Dang Xu, Pengqi Chen, Kaichao Fu, Changcheng Sang, Ruizhi Chen, Tao Hong, Keke Chang, Jigui Cheng and Kai Xu
Hefei University of Technology, Hefei University of Technology, Hefei University of Technology, affiliation not provided to SSRN, Hefei University of Technology, Hefei University of Technology, Chinese Academy of Sciences (CAS) - Ningbo Institute of Materials Technology and Engineering, Hefei University of Technology and affiliation not provided to SSRN
Downloads 18 (1,525,626)

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W-Cu joint, CrCoNi MEA, Element diffusion, Mechanical property, Strengthening mechanism

Connection Reinforcement Design of W-Cu Joint: Transforming Immiscible Interface into Dual Reaction Diffusion Interface

Number of pages: 45 Posted: 24 Dec 2024
Dang Xu, Pengqi Chen, Kaichao Fu, Changcheng Sang, Ruizhi Chen, Tao Hong, Jigui Cheng and Kai Xu
Hefei University of Technology, Hefei University of Technology, Hefei University of Technology, affiliation not provided to SSRN, Hefei University of Technology, Hefei University of Technology, Hefei University of Technology and affiliation not provided to SSRN
Downloads 14 (1,579,999)

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W-Cu joint, CrCoNi MEA, Element diffusion, mechanical property, Strengthening mechanism

2.

A Pressure-Induced Strategy for Graphene-Templated Crystal Alignment in Copper Matrix Composites for Enhanced Thermal Conductivity

Downloads 26 (1,411,822)

A Pressure-Induced Strategy for Graphene-Templated Crystal Alignment in Copper Matrix Composites for Enhanced Thermal Conductivity

Number of pages: 31 Posted: 21 Mar 2026
Baishan Liu, Jie Gao, Tianyu Zhao, Tao Hong, Juncai Liang, Zhongzheng Pei, Yalun Wang, Jian Yang, Pengqi Chen, Jigui Cheng, Xiaohui Zhang and Kyle Brinkman
affiliation not provided to SSRN, Hefei University of Technology, affiliation not provided to SSRN, Hefei University of Technology, affiliation not provided to SSRN, affiliation not provided to SSRN, affiliation not provided to SSRN, University of Science and Technology Beijing, Hefei University of Technology, Hefei University of Technology, affiliation not provided to SSRN and Clemson University - Department of Materials Science and Engineering
Downloads 13 (1,589,301)

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Copper texture, Graphene, High temperature pressing, Template

A Pressure-Induced Strategy for Graphene-Templated Crystal Alignment in Copper Matrix Composites for Enhanced Thermal Conductivity

Number of pages: 31 Posted: 22 May 2026
Baishan Liu, Jie Gao, Tianyu Zhao, Tao Hong, Juncai Liang, Zhongzheng Pei, Yalun Wang, Jian Yang, Pengqi Chen, Kyle Brinkman, Xiaohui Zhang and Jigui Cheng
affiliation not provided to SSRN, Hefei University of Technology, affiliation not provided to SSRN, Hefei University of Technology, affiliation not provided to SSRN, affiliation not provided to SSRN, affiliation not provided to SSRN, University of Science and Technology Beijing, Hefei University of Technology, Clemson University - Department of Materials Science and Engineering, affiliation not provided to SSRN and Hefei University of Technology
Downloads 13 (1,598,105)

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Copper texture, Graphene, High temperature pressing, Template

3.

Multi-Factor Coupled Failure Mechanism of W-Cu Functionally Graded Material Under Thermal Shock Service

Number of pages: 28 Posted: 19 Sep 2023
Pengqi Chen, Dang Xu, Chengyang Huang, Jian Yang, Yunxiao Tai, Tao Hong, Jigui Cheng and Hongyu Chen
Hefei University of Technology, Hefei University of Technology, Hefei University of Technology, Hefei University of Technology, Hefei University of Technology, Hefei University of Technology, Hefei University of Technology and Zhejiang University of Technology
Downloads 16 (1,500,778)

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W-Cu FGM, Thermal shock, Failure mechanism, Microcrack

4.

Connection Reinforcement Design of W/Cu Joint: Transforming Immiscible Interface into Dual Reaction Diffusion Interface

Number of pages: 47 Posted: 12 Jun 2025
Dang Xu, Pengqi Chen, Kaichao Fu, Changcheng Sang, Ruizhi Chen, Tao Hong, Jigui Cheng and Kai Xu
Hefei University of Technology, Hefei University of Technology, Hefei University of Technology, affiliation not provided to SSRN, Hefei University of Technology, Hefei University of Technology, Hefei University of Technology and affiliation not provided to SSRN
Downloads 11 (1,541,665)

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W/Cu joint, CrCoNi MEA, Element diffusion, Mechanical property, Strengthening mechanism

5.

Ultrafast High‑Temperature Sintering of W Skeletons Followed by Cu Infiltration: Rapid Fabrication and Property Optimization of W-Cu Composites

Number of pages: 32 Posted: 01 Jun 2026
Pengqi Chen, Jiarui Su, Chengyang Huang, Tao Hong, Jian Fu, Dang Xu, Jigui Cheng and Hongyu Chen
Hefei University of Technology, affiliation not provided to SSRN, Hefei University of Technology, Hefei University of Technology, affiliation not provided to SSRN, Hefei University of Technology, Hefei University of Technology and Zhejiang University of Technology
Downloads 8 (1,575,921)

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W-Cu composites, Ultrafast high-temperature sintering, W skeleton, Infiltration, mechanical properties