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Kerong Yang

affiliation not provided to SSRN

  • affiliation not provided to SSRN

SCHOLARLY PAPERS

3

DOWNLOADS

145

TOTAL CITATIONS

1

Scholarly Papers (3)

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1.

Epoxy Vitrimer/Boron Nitride Composite with High Thermal Conductivity, Interface Adaptability, and Full-Component Recyclability for Sustainable Thermal Interface Material

Number of pages: 27 Posted: 17 Apr 2023
Jingkai Liu, Haoyang Feng, Jinyue Dai, Kerong Yang, Guangmeng Chen, Shuaipeng Wang, Dandan Jin and Xiaoqing Liu
affiliation not provided to SSRN, affiliation not provided to SSRN, affiliation not provided to SSRN, affiliation not provided to SSRN, affiliation not provided to SSRN, affiliation not provided to SSRN, affiliation not provided to SSRN and affiliation not provided to SSRN
Downloads 103 (684,672)

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Epoxy vitrimer, Boron nitride, Recycle, Thermal Conductivity, Thermal interface material (TIM)

2.

Bio-Based Epoxy Resin Demonstrating High Breakdown Strength and Low Dielectric Loss Via Intrinsic Molecular Charge Traps Construction

Number of pages: 36 Posted: 14 May 2024
Kerong Yang, Jinyue Dai, Weiwei Zhao, Shuaipeng Wang and Xiaoqing Liu
affiliation not provided to SSRN, affiliation not provided to SSRN, affiliation not provided to SSRN, affiliation not provided to SSRN and affiliation not provided to SSRN
Downloads 22 (1,424,331)
Citation 1

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Bio-based epoxy resin, Molecular charge traps, Breakdown strength, Dielectric loss.

3.

Enhanced Breakdown Strength of Epoxy Composites by Constructing Dual-Interface Charge Barriers at the Micron Filler/Epoxy Matrix Interface

Number of pages: 26 Posted: 21 Mar 2024
Xiaoqing Liu, Kerong Yang and Yushun Zhao
affiliation not provided to SSRN, affiliation not provided to SSRN and Hefei University of Technology
Downloads 20 (1,448,301)

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Epoxy-based dielectric materials, Breakdown strength, Dual-interface charge barriers, Charge traps