affiliation not provided to SSRN
Keywords: c-BN/Cu interface, Doping, Adhesion, Electronic properties, First-principles calculations
Elliptical ultrasonic vibration-assisted grinding, Undeformed chip thickness, Wheel topography evolution, Silicon carbide, grinding performance, Plastic-brittle removal
First-principles calculations, Doping-Cr/Ti Cu solid solution/diamond interface, Adhesive work, Brazing
Single-crystal turbine blade tenon, Ultrasonic vibration-assisted profile grinding, Micro-nano characterization, Gradient micro-nano structure