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Kun Zhang

Zhejiang University

38 Zheda Road

Hangzhou, 310058

China

  • Zhejiang University

SCHOLARLY PAPERS

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Scholarly Papers (1)

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Undeformed Chip Thickness Modeling in Euvag Considering Wheel Topography Evolution

Number of pages: 87 Posted: 12 Mar 2025
Kun Zhang, Zhen Yin, Yanjun Lu, Chenwei Dai, Qinglong An, Liang Zhiqiang, Qing Miao, Ming Zhang, Ziyang Cao and Hua Li
Zhejiang University, affiliation not provided to SSRN, Shenzhen University, affiliation not provided to SSRN, affiliation not provided to SSRN, Beijing Institute of Technology, affiliation not provided to SSRN, affiliation not provided to SSRN, affiliation not provided to SSRN and affiliation not provided to SSRN
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Abstract:

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Elliptical ultrasonic vibration-assisted grinding, Undeformed chip thickness, Wheel topography evolution, Silicon carbide, grinding performance, Plastic-brittle removal