Chenguang Sun

Hebei University of Technology

Tianjin

China

  • Hebei University of Technology

SCHOLARLY PAPERS

3

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130

TOTAL CITATIONS

0

Scholarly Papers (3)

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1.

Study on Intrinsic Void Defects at the Bonding Interface of 200mm Soi Wafers

Number of pages: 14 Posted: 12 Dec 2023
Guifeng Chen, Chenguang Sun, Qianzhi Ma, Xingtian Ai, Hui Zhang and Xinjian Xie
Hebei University of Technology, Hebei University of Technology, affiliation not provided to SSRN, Hebei University of Technology, Hebei University of Technology and Hebei University of Technology
Downloads 57 (785,297)

Abstract:

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Key words: Bonding, Intrinsic void, substrate, interface, surface defects

2.

Study on Reducing Triangular Defects in 4h-Sic Epilayers

Downloads 40 (921,797)

Study on Reducing Triangular Defects in 4h-Sic Epilayers

Number of pages: 39 Posted: 07 Sep 2024
Tao Sun, Wei Li, Chenguang Sun, Haibo Chen, Yongheng Luo, Jinlian Bi, Yupeng Xing and Yujie Yuan
Tianjin University of Technology, Tianjin University of Technology, Hebei University of Technology, affiliation not provided to SSRN, affiliation not provided to SSRN, Tianjin University of Technology, Tianjin University of Technology and Tianjin University of Technology
Downloads 28 (1,076,513)

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Triangular defects, 4H-SiC, Homoepitaxial layers, Die failure rate

Study on Reducing Triangular Defects in 4h-Sic Epilayers

Number of pages: 28 Posted: 24 Oct 2024
Tao Sun, Wei Li, Chenguang Sun, Jinlian Bi, Haibo Chen, Yongheng Luo, Yupeng Xing and Yujie Yuan
Tianjin University of Technology, Tianjin University of Technology, Hebei University of Technology, Tianjin University of Technology, affiliation not provided to SSRN, affiliation not provided to SSRN, Tianjin University of Technology and Tianjin University of Technology
Downloads 12 (1,287,655)

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Triangular defects, 4H-SiC, Homoepitaxial layers, Die failure rate

3.

The Effect of Rtp Pretreatment on Slip-Lines Of Argon Annealed Silicon Wafer

Number of pages: 10 Posted: 21 Oct 2023
Guifeng Chen, Chenguang Sun, Hu Wang, Xingtian Ai, Hui Zhang, Zixuan Xue and Xinjian Xie
Hebei University of Technology, Hebei University of Technology, affiliation not provided to SSRN, Hebei University of Technology, Hebei University of Technology, affiliation not provided to SSRN and Hebei University of Technology
Downloads 33 (991,599)

Abstract:

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Argon annealing, RTP, Slip-lines, OISF, BMD, Silicon wafer