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Jiajun Liu

affiliation not provided to SSRN

  • affiliation not provided to SSRN

SCHOLARLY PAPERS

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Accelerated Solid-Liquid Interdiffusion Bonding of Cu Joint Using a Cu10ni Alloy Mesh Reinforced Sac305 Composite Solder

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Accelerated Solid-Liquid Interdiffusion Bonding of Cu Joint Using a Cu10ni Alloy Mesh Reinforced Sac305 Composite Solder

Number of pages: 28 Posted: 12 Dec 2023
Jiajun Liu, Yong Xiao, Dan Li, Bowen Liu, Fei Yan and Jian Zhang
affiliation not provided to SSRN, Wuhan University of Technology - School of Material Science and Engineering, Wuhan University of Technology, affiliation not provided to SSRN, Wuhan University of Technology and Wuhan University of Technology
Downloads 17 (1,537,408)

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Intermetallic, Composite solder, Solid-liquid interdiffusion, Interface reaction, grain refinement

Accelerated Solid-Liquid Interdiffusion Bonding of Cu Joint Using a Cu10ni Alloy Mesh Reinforced Sac305 Composite Solder

Number of pages: 33 Posted: 06 Jan 2024
Jiajun Liu, Yong Xiao, Dan Li, Bowen Liu, Fei Yan, Shuye Zhang and Jian Zhang
affiliation not provided to SSRN, Wuhan University of Technology - School of Material Science and Engineering, Wuhan University of Technology, affiliation not provided to SSRN, Wuhan University of Technology, Harbin Institute of Technology and Wuhan University of Technology
Downloads 15 (1,559,710)

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Solid-liquid interdiffusion bonding, Cu-10Ni (wt.%) alloy mesh, SAC305 composite solder, EBSD characterization, Mechanical properties