92 West Dazhi Street
Nan Gang District
Harbin, 150001
China
Harbin Institute of Technology
Cu@Ag solder preform, electromagnetic compaction, Microstructure, electrical property, thermal property, electrochemical migration
Selective laser melting, 316L stainless Steel, Mechanical Properties, Corrosion resistance
Selective microwave hybrid soldering, Susceptor, Multi-physics simulation
Polyaniline, Composites, Preparation and characterization, Thermoelectric performance
Solid-liquid interdiffusion bonding, Cu-10Ni (wt.%) alloy mesh, SAC305 composite solder, EBSD characterization, Mechanical properties
Electromigration, Failure behavior, simulation, Micro-hybrid solder joints
X-WSe2/Ti2CO2 vdW-HS, Doping effect, Density of states, Optical properties, First-principles calculation
Radiative cooling, Anti-aging, Composite fabric, Electrospinning
Flexible strain sensors, high-entropy alloy nanoparticles, reduced graphene oxide, wearable devices, human motion monitoring
Ag-rGO, composite conductive films, pulsed light sintering, interfacial densification, electromechanical sensing, EMI shielding, bioelectronic interface
Nanoparticles, interfaces, Microwave hybrid heating, SAC305 joints, Embedded susceptor, Exposure Time
Diffusion bonding, Micro-laminated composites, TiBw, Tensile Behavior, Microstructure, Gradient fracture.
Diffusion bonding, Micro-laminated composites, TiBw, tensile behavior, Microstructure, Gradient fracture