Diffusion bonding, Micro-laminated composites, TiBw, Tensile Behavior, Microstructure, Gradient fracture.
Stretchable conductors, Crack compensation, Liquid metal, Conductive film, EGaIn
GF/PPS, micro-arc oxidation, silane coupling agent, resistance welding, ultrasonic assistance.
Diffusion bonding, Micro-laminated composites, TiBw, tensile behavior, Microstructure, Gradient fracture
GF/PPS, ultrasonic welding, simulation, preheating, optimization, temperature field