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Liqiang Cao

State Key Lab. of Metal Matrix Composites, Key Lab. for Thin Film and Microfabrication Technology of the Ministry of Education, School of Materials Science and Eng., Shanghai Jiao Tong University

Shanghai 200030, Shanghai 200052

China

SCHOLARLY PAPERS

3

DOWNLOADS

108

TOTAL CITATIONS

1

Scholarly Papers (3)

1.

Physical feature-based machine learning of BEOL thermal conductivity in 3D ICs

Number of pages: 5 Posted: 18 Oct 2025
affiliation not provided to SSRN, affiliation not provided to SSRN, affiliation not provided to SSRN, affiliation not provided to SSRN, affiliation not provided to SSRN, affiliation not provided to SSRN and State Key Lab. of Metal Matrix Composites, Key Lab. for Thin Film and Microfabrication Technology of the Ministry of Education, School of Materials Science and Eng., Shanghai Jiao Tong University
Downloads 45 (1,157,785)

Abstract:

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2.

Monolithically Integrated Manifold Microchannels and Near-Chip Cooling in 3d All-Silicon Radio Frequency Microsystems

Number of pages: 19 Posted: 05 Aug 2025
affiliation not provided to SSRN, affiliation not provided to SSRN, affiliation not provided to SSRN, State Key Lab. of Metal Matrix Composites, Key Lab. for Thin Film and Microfabrication Technology of the Ministry of Education, School of Materials Science and Eng., Shanghai Jiao Tong University, affiliation not provided to SSRN, affiliation not provided to SSRN and affiliation not provided to SSRN
Downloads 36 (1,249,711)

Abstract:

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RF microsystem, manifold, near-chip cooling, monolithically integrated

3.

Investigation on Electromigration Failure Behavior of Sac305/Snpb Micro-Hybrid Solder Joints for Package-on-Package Techniques: Experiment and Simulation

Number of pages: 12 Posted: 14 Aug 2024
Harbin Institute of Technology, Harbin Institute of Technology, Harbin Institute of Technology, State Key Lab. of Metal Matrix Composites, Key Lab. for Thin Film and Microfabrication Technology of the Ministry of Education, School of Materials Science and Eng., Shanghai Jiao Tong University, Harbin Institute of Technology, Harbin Institute of Technology, Harbin Institute of Technology, Harbin Institute of Technology, Harbin Institute of Technology and Harbin Institute of Technology
Downloads 27 (1,359,097)
Citation 1

Abstract:

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Electromigration, Failure behavior, simulation, Micro-hybrid solder joints