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Shanjun Ding

affiliation not provided to SSRN

  • affiliation not provided to SSRN

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Monolithically Integrated Manifold Microchannels and Near-Chip Cooling in 3d All-Silicon Radio Frequency Microsystems

Number of pages: 19 Posted: 05 Aug 2025
Chuan Chen, Yunqian Song, Rong Fu, Liqiang Cao, Jianyu Feng, Qidong Wang and Shanjun Ding
affiliation not provided to SSRN, affiliation not provided to SSRN, affiliation not provided to SSRN, State Key Lab. of Metal Matrix Composites, Key Lab. for Thin Film and Microfabrication Technology of the Ministry of Education, School of Materials Science and Eng., Shanghai Jiao Tong University, affiliation not provided to SSRN, affiliation not provided to SSRN and affiliation not provided to SSRN
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Abstract:

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RF microsystem, manifold, near-chip cooling, monolithically integrated