affiliation not provided to SSRN
High-entropy alloy, Vacuum hot-compression bonding, Initial microstructure, Dynamic recrystallization, Interfacial bonding quality
Plasma arc, additive manufacturing, Numerical model, Heat input regulation, heat source tracking
Plasma arc, Additive Manufacturing, Inconel 718, Alternating magnetic field, Laves phase.
Keywords: Ti-Cu alloy, Laser metal deposition, Microstructural refinement, Mechanical properties, strengthening mechanisms
Initial grain size, High-entropy alloy, Vacuum hot-compression bonding, Mechanical property, Interfacial bonding behavior
High-entropy alloy, Vacuum hot-compression bonding, Surface shot peening, Interfacial microstructure, Bonding mechanism
X-WSe2/Ti2CO2 vdW-HS, Doping effect, Density of states, Optical properties, First-principles calculation
In-situ thermal management, Plasma arc-based additive manufacturing, Inconel 625, Heterogeneity, Thermal history.
SUS304 austenite stainless steel, round bar-plate rotary friction welding, shot peening, Microstructure, Residual Stress, Fatigue life
Ultrasonic pulse arc welding, Single crystal super-alloys, Polycrystalline transformation, Microstructural segregation
High-entropy alloy, Vacuum hot-compression bonding, Twin-induced interfacial boundary migration, Dynamic recrystallization, Interfacial oxide particle
Vacuum hot-compression bonding, Transient deformation, Dynamic recrystallization, Twin boundary, High-entropy alloy
high-entropy alloy, Vacuum hot-compression bonding, strain rate, Twin boundary, Dynamic recrystallization, Bonding quality prediction
Dissimilar joint, White bright band, Helium ion irradiation, Moderate-temperature annealing, Helium bubbles, Nanoindentation
Vacuum hot-compression bonding, Strain rate, Bonding interface, Diffusion, Dynamic recrystallization
Plasma arc cladding, Nickel-based alloys, WC, Particle distribution, Alternating magnetic field