shanghai, 201620
China
Shanghai University of Engineering Science
Initial grain size, High-entropy alloy, Vacuum hot-compression bonding, Mechanical property, Interfacial bonding behavior
Dissimilar joint, White bright band, Helium ion irradiation, Moderate-temperature annealing, Helium bubbles, Nanoindentation
Plasma arc cladding, Nickel-based alloys, WC, Particle distribution, Alternating magnetic field