affiliation not provided to SSRN
High-entropy alloy, Vacuum hot-compression bonding, Initial microstructure, Dynamic recrystallization, Interfacial bonding quality
Plasma arc, additive manufacturing, Numerical model, Heat input regulation, heat source tracking
Keywords: Ti-Cu alloy, Laser metal deposition, Microstructural refinement, Mechanical properties, strengthening mechanisms
Initial grain size, High-entropy alloy, Vacuum hot-compression bonding, Mechanical property, Interfacial bonding behavior
High-entropy alloy, Vacuum hot-compression bonding, Surface shot peening, Interfacial microstructure, Bonding mechanism
X-WSe2/Ti2CO2 vdW-HS, Doping effect, Density of states, Optical properties, First-principles calculation
In-situ thermal management, Plasma arc-based additive manufacturing, Inconel 625, Heterogeneity, Thermal history.
High-entropy alloy, Vacuum hot-compression bonding, Twin-induced interfacial boundary migration, Dynamic recrystallization, Interfacial oxide particle
Vacuum hot-compression bonding, Transient deformation, Dynamic recrystallization, Twin boundary, High-entropy alloy
high-entropy alloy, Vacuum hot-compression bonding, strain rate, Twin boundary, Dynamic recrystallization, Bonding quality prediction
Dissimilar joint, White bright band, Helium ion irradiation, Moderate-temperature annealing, Helium bubbles, Nanoindentation