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Zbynek Plachy

affiliation not provided to SSRN

  • affiliation not provided to SSRN

SCHOLARLY PAPERS

2

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77

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0

Scholarly Papers (2)

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1.

Sustainable Printed Circuit Board Substrates Based on Flame-Retarded Pla/Flax Composites to Reduce Environmental Load of Electronics: Quality, Reliability, Degradation and Application Tests

Number of pages: 29 Posted: 20 Dec 2023
Csaba Farkas, László Gál, András Csiszár, Vincent Grennerat, Pierre-Olivier Jeannin, Pascal Xavier, Dániel Rigler, Olivér Krammer, Zbynek Plachy, Karel Dusek, Robert Kovács, Anna Fehér Éva and Attila Géczy
Budapest University of Technology and Economics, Budapest University of Technology and Economics, affiliation not provided to SSRN, University Grenoble Alpes, University Grenoble Alpes, University Grenoble Alpes, Budapest University of Technology and Economics, Budapest University of Technology and Economics, affiliation not provided to SSRN, affiliation not provided to SSRN, Budapest University of Technology and Economics, Budapest University of Technology and Economics and Budapest University of Technology and Economics - Department of Electronics Technology
Downloads 50 (1,074,648)

Abstract:

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sustainable electronics, printed circuit board substrate, PCB, biodegradable PCB, e-waste reduction, environmentally-friendly electronics

2.

Impact of Curing Profiles on the Thermo-Mechanical Properties of an Underfill in Board-Level Microelectronic Packaging: Effect on Reliability

Number of pages: 34 Posted: 21 Jun 2025
Zbynek Plachy, Jonáš Uřičář, Denis Froš, Anna Pražanová, Karel Dušek and Attila Géczy
affiliation not provided to SSRN, Czech Technical University, affiliation not provided to SSRN, affiliation not provided to SSRN, Czech Technical University and Budapest University of Technology and Economics - Department of Electronics Technology
Downloads 27 (1,372,601)

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underfill, curing kinetics, reliability, mechanical properties, DMA