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Denis Froš
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Scholarly Papers (1)
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1.
Impact of Curing Profiles on the Thermo-Mechanical Properties of an Underfill in Board-Level Microelectronic Packaging: Effect on Reliability
Number of pages: 34
Posted: 21 Jun 2025
Zbynek Plachy
,
Jonáš Uřičář
, Denis Froš,
Anna Pražanová
,
Karel Dušek
and
Attila Géczy
affiliation not provided to SSRN
, Czech Technical University,
affiliation not provided to SSRN
,
affiliation not provided to SSRN
, Czech Technical University and Budapest University of Technology and Economics - Department of Electronics Technology
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Abstract:
underfill, curing kinetics, reliability, mechanical properties, DMA
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