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Ketan Anand

IHP-Leibniz-Institut für innovative Mikroelektronik

PhD student

Im Technologiepark 25

Frankfurt (Oder), 15236

Germany

SCHOLARLY PAPERS

1

DOWNLOADS

102

TOTAL CITATIONS

0

Ideas:
“  I'm currently working on the Hetero-integration of InP (Group III/V materials) on SiO2 (Group IV materials) using Micro-Transfer Printing and also worked on Lateral Selective SiGe Growth for Dislocation-Free Virtual Substrate Fabrication using Epitaxy. I have also been involved in the fabrication of low dislocation density SiGe buffers for qubit applications (cleanroom experience).  ”

Scholarly Papers (1)

1.

Adhesive-Free Bonding for Hetero-Integration of Inp Based Coupons Micro-Transfer Printed on Sio2 into Cmos Backend for Si Photonics Application on 8” Wafer Platform

Number of pages: 34 Posted: 22 Jan 2024
IHP-Leibniz-Institut für innovative Mikroelektronik, affiliation not provided to SSRN, affiliation not provided to SSRN, affiliation not provided to SSRN, IHP-Leibniz-Institut für innovative Mikroelektronik, affiliation not provided to SSRN, affiliation not provided to SSRN, affiliation not provided to SSRN, affiliation not provided to SSRN, affiliation not provided to SSRN, affiliation not provided to SSRN, University of Kassel, University of Kassel, affiliation not provided to SSRN and affiliation not provided to SSRN
Downloads 102 (679,608)

Abstract:

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hetero-integration, micro-transfer printing, Indium Phosphide, Silicon Oxide, sacrificial layer, oxygen plasma activation