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Giulia Lecci

affiliation not provided to SSRN

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Adhesive-Free Bonding for Hetero-Integration of Inp Based Coupons Micro-Transfer Printed on Sio2 into Cmos Backend for Si Photonics Application on 8” Wafer Platform

Number of pages: 34 Posted: 22 Jan 2024
Ketan Anand, Patrick Steglich, Jochen Kreissl, Carlos Alvarado Chavarin, Davide Spirito, Max Franck, Giulia Lecci, Ioan Costina, Norbert Herfurth, Jens Katzer, Christian Mai, Annette Becker, Johann Peter Reithmaier, Lars Zimmermann and Andreas Mai
IHP-Leibniz-Institut für innovative Mikroelektronik, affiliation not provided to SSRN, affiliation not provided to SSRN, affiliation not provided to SSRN, IHP-Leibniz-Institut für innovative Mikroelektronik, affiliation not provided to SSRN, affiliation not provided to SSRN, affiliation not provided to SSRN, affiliation not provided to SSRN, affiliation not provided to SSRN, affiliation not provided to SSRN, University of Kassel, University of Kassel, affiliation not provided to SSRN and affiliation not provided to SSRN
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hetero-integration, micro-transfer printing, Indium Phosphide, Silicon Oxide, sacrificial layer, oxygen plasma activation