Doojin Jeong

Inha University

253 Yonghyun-dong

Nam-gu Incheon 402-751

Korea, Republic of (South Korea)

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Microstructure and Bonding Properties of Transient Liquid-Phase Bonding Using Cu–Snagcu Molded Sheets by High Pressure Powder Compression

Number of pages: 23 Posted: 12 Mar 2024

Icizo Sakamoto, Doojin Jeong, Hiroaki Tatsumi and Hiroshi Nishikawa

The University of Osaka, Inha University, The University of Osaka and The University of Osaka

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