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Hiroshi Nishikawa

The University of Osaka

SCHOLARLY PAPERS

3

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121

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0

Scholarly Papers (3)

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1.

Effect of Copper on Interfacial Reaction and Microstructure of Soldering on Aluminum Substrate

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Effect of Copper on Interfacial Reaction and Microstructure of Soldering on Aluminum Substrate

Number of pages: 33 Posted: 05 Mar 2025
Jiahui Li, Yu-An Shen, Hiroaki Tatsumi, Hiren R. Kotadia, Runhua Gao and Hiroshi Nishikawa
affiliation not provided to SSRN, Feng Chia University, The University of Osaka, Liverpool John Moores University, affiliation not provided to SSRN and The University of Osaka
Downloads 32 (1,326,242)

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Aluminum, Copper, Soldering, Interfacial Reaction, Microstructure, CALPHAD

Effect of Copper on Interfacial Reaction and Microstructure of Soldering on Aluminum Substrate

Number of pages: 33 Posted: 02 Apr 2025
Jiahui Li, Yu-An Shen, Hiroaki Tatsumi, Hiren R. Kotadia, Runhua Gao and Hiroshi Nishikawa
affiliation not provided to SSRN, Feng Chia University, The University of Osaka, Liverpool John Moores University, affiliation not provided to SSRN and The University of Osaka
Downloads 27 (1,400,723)

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Aluminum, Copper, Soldering, interfacial reaction, microstructure, CALPHAD

2.

Microstructure and Bonding Properties of Transient Liquid-Phase Bonding Using Cu–Snagcu Molded Sheets by High Pressure Powder Compression

Number of pages: 23 Posted: 12 Mar 2024
Icizo Sakamoto, Doojin Jeong, Hiroaki Tatsumi and Hiroshi Nishikawa
The University of Osaka, Inha University, The University of Osaka and The University of Osaka
Downloads 39 (1,196,171)

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semiconductors, thermoelectric materials, Powder metallurgy, microstructure, mechanical properties

3.

Interfacial Reaction and Imc Growth Kinetics at Bi2te3/Ag Interface During Isothermal Aging

Number of pages: 26 Posted: 30 Aug 2024
SeongWoo Pak, Hiroaki Tatsumi, Jianhao Wang and Hiroshi Nishikawa
The University of Osaka, The University of Osaka, The University of Osaka and The University of Osaka
Downloads 23 (1,411,822)

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intermetallic compound, IMC growth kinetics, Microstructural evolution, thermoelectric, Ag sintering