default author photo

Jiahui Li

affiliation not provided to SSRN

  • affiliation not provided to SSRN

SCHOLARLY PAPERS

1

DOWNLOADS

63

TOTAL CITATIONS

0

Scholarly Papers (1)

Actions:
Email selected abstracts
1.

Effect of Copper on Interfacial Reaction and Microstructure of Soldering on Aluminum Substrate

Downloads 63 (970,490)

Effect of Copper on Interfacial Reaction and Microstructure of Soldering on Aluminum Substrate

Number of pages: 33 Posted: 05 Mar 2025
Jiahui Li, Yu-An Shen, Hiroaki Tatsumi, Hiren R. Kotadia, Runhua Gao and Hiroshi Nishikawa
affiliation not provided to SSRN, Feng Chia University, The University of Osaka, Liverpool John Moores University, affiliation not provided to SSRN and The University of Osaka
Downloads 34 (1,326,242)

Abstract:

Loading...

Aluminum, Copper, Soldering, Interfacial Reaction, Microstructure, CALPHAD

Effect of Copper on Interfacial Reaction and Microstructure of Soldering on Aluminum Substrate

Number of pages: 33 Posted: 02 Apr 2025
Jiahui Li, Yu-An Shen, Hiroaki Tatsumi, Hiren R. Kotadia, Runhua Gao and Hiroshi Nishikawa
affiliation not provided to SSRN, Feng Chia University, The University of Osaka, Liverpool John Moores University, affiliation not provided to SSRN and The University of Osaka
Downloads 29 (1,400,723)

Abstract:

Loading...

Aluminum, Copper, Soldering, interfacial reaction, microstructure, CALPHAD