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Marco Contino

Polytechnic University of Milan

SCHOLARLY PAPERS

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Scholarly Papers (3)

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1.

Delamination of Copper/Moulding Compound Interfaces in Microelectronics Packaging

9TH INTERNATIONAL CONFERENCE ON FRACTURE OF POLYMERS, COMPOSITES & ADHESIVES:O14.3
Posted: 28 Mar 2024
Luca Andena, Marco Contino, Federico Olla, Stefano Mariani, Samuele Zalaffi, Claudio Maria Villa, Carlo Passagrilli and Marco Rovitto
Polytechnic University of Milan, Polytechnic University of Milan, Polytechnic University of Milan, Polytechnic University of Milan, STMicroelectronics, STMicroelectronics, STMicroelectronics and STMicroelectronics

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2.

Influence of Morpho-Structural Parameters on the Environmental Stress Cracking of Polyethylene

9TH INTERNATIONAL CONFERENCE ON FRACTURE OF POLYMERS, COMPOSITES & ADHESIVES:O03.1
Posted: 28 Mar 2024
Marco Contino, Luca Andena, Marta Rink, Federico Olla, Francesco Scavello, Dino Ferri and Leonardo Castellani
Polytechnic University of Milan, Polytechnic University of Milan, Polytechnic University of Milan, Polytechnic University of Milan, Versalis SpA, Versalis SpA and affiliation not provided to SSRN

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3.

Fracture of Polyjet 3d Printed Materials: A Preliminary Investigation

9TH INTERNATIONAL CONFERENCE ON FRACTURE OF POLYMERS, COMPOSITES & ADHESIVES:O09.3
Posted: 28 Mar 2024
Marco Contino, Luca Andena, Margherita Arioli, Tim Volders, Davide Ruffoni and Federico Passoni
Polytechnic University of Milan, Polytechnic University of Milan, affiliation not provided to SSRN, University of Liège, University of Liège and Polytechnic University of Milan

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