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Marco Rovitto
STMicroelectronics
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Scholarly Papers (1)
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Delamination of Copper/Moulding Compound Interfaces in Microelectronics Packaging
9TH INTERNATIONAL CONFERENCE ON FRACTURE OF POLYMERS, COMPOSITES & ADHESIVES:O14.3
Posted: 28 Mar 2024
Luca Andena
,
Marco Contino
,
Federico Olla
,
Stefano Mariani
,
Samuele Zalaffi
,
Claudio Maria Villa
,
Carlo Passagrilli
and Marco Rovitto
Polytechnic University of Milan, Polytechnic University of Milan, Polytechnic University of Milan, Polytechnic University of Milan, STMicroelectronics, STMicroelectronics, STMicroelectronics and STMicroelectronics
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