affiliation not provided to SSRN
R1233zd(E), pool boiling, Aluminum, Micro-pin finned surfaces, thermal management
3D thermosyphon, Data Center Cooling, Air Cooling, model prediction
Electronics Cooling, Three-dimensional thermosyphon, Boiling heat transfer enhancement, Aluminum.
Heat pipe, Thermal hysteresis, Temperature cycling, Capillary limit, Dryout
Pool boiling, Microstructured surface, Critical heat flux, Heat transfer coefficient, R1233zd(E)