Agriculture Hall
East Lansing, MI 48824-1122
United States
Michigan State University
Power electronics, thermal management, heat sink, direct bonded copper (DBC), thermal interface material (TIM), spacer, SiC power module, substrate, electronics cooling.
Humidification-dehumidification, Crossflow, packed bed, Direct Contact, Humidification, Thermal desalination
Oscillating Water Column (OWC), Humidification-Dehumidification (HDH), desalination, wave energy, Co-generation, Packed Bed