affiliation not provided to SSRN
Power electronics, thermal management, heat sink, direct bonded copper (DBC), thermal interface material (TIM), spacer, SiC power module, substrate, electronics cooling.
Augmented Reality, Deep Learning, welding defect detection, TensorFlow, Unity 3D, Industry 4.0
Reward-directed diffusion, Non-differentiable surrogate, Soft value function, Gradient-free optimization, Ship hull design
