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Yongxia Chen

Civil Aviation University of China

Tianjin

China

SCHOLARLY PAPERS

1

DOWNLOADS

69

TOTAL CITATIONS

0

Scholarly Papers (1)

1.

Analysis of Bga Lead-Free Solder Joints Failure Behavior Based on Thermal Shock Testing

Number of pages: 21 Posted: 15 Jul 2024
Xiaoxiao Song, Yongxia Chen, Zewen Xiao and Yajun Chen
Civil Aviation University of China, Civil Aviation University of China, Civil Aviation University of China and Civil Aviation University of China
Downloads 69 (883,195)

Abstract:

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Lead-free solder joints, Ball grid array, Temperature shock, Failure analysis