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Zewen Xiao

Civil Aviation University of China

Tianjin

China

SCHOLARLY PAPERS

1

DOWNLOADS

69

TOTAL CITATIONS

0

Scholarly Papers (1)

1.

Analysis of Bga Lead-Free Solder Joints Failure Behavior Based on Thermal Shock Testing

Number of pages: 21 Posted: 15 Jul 2024
Civil Aviation University of China, Civil Aviation University of China, Civil Aviation University of China and Civil Aviation University of China
Downloads 69 (883,195)

Abstract:

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Lead-free solder joints, Ball grid array, Temperature shock, Failure analysis