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Chenxiao Li

Inha University

253 Yonghyun-dong

Nam-gu Incheon 402-751

Korea, Republic of (South Korea)

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Scholarly Papers (1)

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Abrasive Grain Retention and Interfacial Failure Analysis of Resin Bond Diamond Abrasive Machining

Number of pages: 17 Posted: 27 Jul 2024
Lei Guo, Jintao Song, Chen Xu, Xiaohui Liu, Chenxiao Li, Bei Wang and Jizhuang Hui
affiliation not provided to SSRN, affiliation not provided to SSRN, affiliation not provided to SSRN, affiliation not provided to SSRN, Inha University, University of Auckland and affiliation not provided to SSRN
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Abstract:

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Abrasive machining, Diamond grain, Resin-bonded tool, Interfacial failure