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Lei Guo

affiliation not provided to SSRN

  • affiliation not provided to SSRN

SCHOLARLY PAPERS

2

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36

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0

Scholarly Papers (2)

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1.

Abrasive Grain Retention and Interfacial Failure Analysis of Resin Bond Diamond Abrasive Machining

Number of pages: 17 Posted: 27 Jul 2024
Lei Guo, Jintao Song, Chen Xu, Xiaohui Liu, Chenxiao Li, Bei Wang and Jizhuang Hui
affiliation not provided to SSRN, affiliation not provided to SSRN, affiliation not provided to SSRN, affiliation not provided to SSRN, Inha University, University of Auckland and affiliation not provided to SSRN
Downloads 19 (1,459,862)

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Abrasive machining, Diamond grain, Resin-bonded tool, Interfacial failure

2.

Bio-Inspired Involute Groove Pad Textures for Enhanced Material Removal and Surface Quality in Sic Chemical Mechanical Polishing

Number of pages: 41 Posted: 19 Jul 2025
Jintao Song, Jizhuang Hui, Lei Guo, Lei Lv, Xiaohui Liu, Qichao Jin, Shunli Lu and Shuming Yang
affiliation not provided to SSRN, affiliation not provided to SSRN, affiliation not provided to SSRN, affiliation not provided to SSRN, affiliation not provided to SSRN, affiliation not provided to SSRN, affiliation not provided to SSRN and affiliation not provided to SSRN
Downloads 17 (1,491,251)

Abstract:

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Chemical mechanical polishing, Silicon carbide, Involute groove, Slurry dynamics, Material removal rate