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Fengzai Tang

University of Warwick

Gibbet Hill Rd.

Coventry, CV4 8UW

United Kingdom

  • University of Warwick

SCHOLARLY PAPERS

2

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89

TOTAL CITATIONS

1

Scholarly Papers (2)

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1.

Identification of the Role of Zinc in Sn–Cu Solder and Interfacial Intermetallic Growth Through Experimental Results and Phase-Field Simulations

Number of pages: 29 Posted: 10 Jan 2025
Hiren R. Kotadia, Alireza Rahnama, Fengzai Tang, JI Ahuir Torres, Geoff West, Amit Das and S.H. Mannan
Liverpool John Moores University, University of Warwick, University of Warwick, Liverpool John Moores University, University of Warwick, Swansea University and King’s College London - Department of Physics
Downloads 70 (883,195)
Citation 1

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Sn-Cu solder, Pb-free solder, Intermetallic compounds (IMCs), Solidification, Phase-field simulations

2.

Solidification Relationship between the Primary–Al Grain and Α–Al15(Fe,Mn)3si2 Intermetallic Phase in the 6082 Wrought Al Alloy

Number of pages: 12 Posted: 06 Aug 2025
Mir-Hamza Khan, Fengzai Tang and Tahir Irfan Khan
University of Warwick, University of Warwick and University of Bradford
Downloads 19 (1,491,251)

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Aluminium alloys, Iron intermetallics, Solidification, Crystallographic Orientation