Gibbet Hill Rd.
Coventry, CV4 8UW
United Kingdom
University of Warwick
Sn-Cu solder, Pb-free solder, Intermetallic compounds (IMCs), Solidification, Phase-field simulations
Creep, dislocations, Wilshire equations
Silicon Carbide, Chemical Vapour Deposition, Heteroepitaxy, Patterned substrate, power electronics
Aluminium to steel weld, Laser beam wobbling, fatigue, intermetallic compounds, battery interconnects
nickel plating, aluminium busbars, Sulfamate electroplating, Electroless nickel, Al-Ni eutectic