Author Page for Bingbo Niu

Actions:

View:
Selected
Original List
All Versions Hide All Versions
All Abstracts Hide All Abstracts

(Rank)

Wetting Study of in and Sn Solders on Alsc Target and Cu Backboard Materials Based on Molecular Dynamics and First-Principles Calculation

Number of pages: 23 Posted: 12 Feb 2025

Xiaofei Zhang, Xiaofeng Zhang, Xvdong Hou, Zicheng Zhou, Bingbo Niu, Xiaochao Wu, Jiaqiang Yang, Chengduo Wang, Qingkui Li and Jilin He

affiliation not provided to SSRN, affiliation not provided to SSRN, affiliation not provided to SSRN, affiliation not provided to SSRN, Zhengzhou University, Zhengzhou University, Zhengzhou University, Zhengzhou University, Zhengzhou University and Zhengzhou University

Downloads 49 (1,074,648)

Abstract:

Preparation of Ag-SnO₂ electrical contact alloys by stirred ball milling and hot-press sintering: Effect of sintering temperature on their microstructure and properties

Number of pages: 48 Posted: 24 Dec 2025

Changyao Xu, Bingbo Niu, Runyu Xiao, Chengwei Tian, Runze Ren, Tianfan Zhang and Qingkui Li

affiliation not provided to SSRN, Zhengzhou University, Zhengzhou University, Zhengzhou University, affiliation not provided to SSRN, affiliation not provided to SSRN and Zhengzhou University

Downloads 32 (1,304,549)

Bingbo Niu

Zhengzhou University

2

81

0

Scholarly Papers (2)

Wetting Study of in and Sn Solders on Alsc Target and Cu Backboard Materials Based on Molecular Dynamics and First-Principles Calculation

Abstract:

Preparation of Ag-SnO₂ electrical contact alloys by stirred ball milling and hot-press sintering: Effect of sintering temperature on their microstructure and properties

Abstract: