Seung-Yeong Lee

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Prediction of Fatigue Life of Semiconductor Package Under Thermal Cycling: Combined Effect of Package Design and Solder Materials

Number of pages: 34 Posted: 14 Feb 2025

Heon-Su Kim, You-Gwon Kim, Dong-Min Jang, Jin-Woo Jang, Seung-Yeong Lee and Hak-Sung Kim

Hanyang University, Hanyang University, affiliation not provided to SSRN, affiliation not provided to SSRN, affiliation not provided to SSRN and Hanyang University

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