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Hak-Sung Kim

Hanyang University

Seoul

Korea, Republic of (South Korea)

  • Hanyang University

SCHOLARLY PAPERS

7

DOWNLOADS

298

TOTAL CITATIONS

1

Scholarly Papers (7)

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1.

Detection of Hidden Defects Inside Polymer Tubes Using Anomaly Detection with Generative Adversarial Neural Network Based on Terahertz Scanning Images

Downloads 74 (852,604)

Detection of Hidden Defects Inside Polymer Tubes Using Anomaly Detection with Generative Adversarial Neural Network Based on Terahertz Scanning Images

Number of pages: 17 Posted: 20 Jun 2023
Heon-Su Kim, Sang-Il Kim, You-Gwon Kim, Dong-Woon Park, Jong-Min Lee and Hak-Sung Kim
Hanyang University, Hanyang University, Hanyang University, Hanyang University, affiliation not provided to SSRN and Hanyang University
Downloads 54 (1,049,673)

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PFA tube, terahertz wave, non-destructive evaluation, anomaly detection, generative adversarial neural network

Detection of Hidden Defects Inside Polymer Tubes Using Anomaly Detection with Generative Adversarial Neural Network Based on Terahertz Scanning Images

Number of pages: 18 Posted: 21 Jun 2024
Heon-Su Kim, Sang-Il Kim, You-Gwon Kim, Dong-Woon Park, Jong-Min Lee and Hak-Sung Kim
Hanyang University, Hanyang University, Hanyang University, Hanyang University, affiliation not provided to SSRN and Hanyang University
Downloads 20 (1,500,232)

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PFA tube, terahertz wave, non-destructive evaluation, anomaly detection, generative adversarial neural network

2.

Synergistic Role of Bi, Ni, and Pd Alloying in Sac305 for Enhanced Imc Suppression and Superior Thermo-Mechanical Performance

Downloads 58 (989,921)

Synergistic Role of Bi, Ni, and Pd Alloying in Sac305 for Enhanced Imc Suppression and Superior Thermo-Mechanical Performance

Number of pages: 50 Posted: 26 Apr 2025
You-Gwon Kim, Heon-Su Kim, Tae-Wan Kim, Hyeong-Bin Park, Jong-Whi Park, Yongrae Jang, Bongtae Han, Jun-Hyeong Lee, Jin-Gyu Kim and Hak-Sung Kim
Hanyang University, Hanyang University, Hanyang University, Hanyang University, Hanyang University, University of Maryland, College Park, University of Maryland, College Park, affiliation not provided to SSRN, affiliation not provided to SSRN and Hanyang University
Downloads 35 (1,296,409)

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SAC305, SAC-BNP, Solder joint reliability, creep, Intermetallic compounds(IMC)

Synergistic Role of Bi, Ni, and Pd Alloying in Sac305 for Enhanced Imc Suppression and Superior Thermo-Mechanical Performance

Number of pages: 33 Posted: 12 Feb 2025
You-Gwon Kim, Heon-Su Kim, Tae-Wan Kim, Hyeong-Bin Park, Jong-Whi Park, Yongrae Jang, Bongtae Han, Jun-Hyeong Lee, Jin-Gyu Kim and Hak-Sung Kim
Hanyang University, Hanyang University, Hanyang University, Hanyang University, Hanyang University, University of Maryland, College Park, University of Maryland, College Park, affiliation not provided to SSRN, affiliation not provided to SSRN and Hanyang University
Downloads 23 (1,459,262)

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SAC305, SAC-BNP, Solder joint reliability, Creep, Intermetallic compounds(IMC)

3.

Facile Manufacturing of Foldable Micro-Supercapacitors Utilizing Pneumatic Printing in Conjunction with Intense Pulsed White Light

Number of pages: 25 Posted: 29 May 2024
Chiho Song, Jeonguk Hwang, Changyoung Park, Sujin Lee, Yeon-Taek Hwang, Hak-Sung Kim, Neetu Bansal, Rahul R. Salunkhe and Heejoon Ahn
Hanyang University, Hanyang University, Hanyang University, Hanyang University, Hanyang University, Hanyang University, Indian Institute of Technology Jammu, Indian Institute of Technology Jammu and Hanyang University
Downloads 53 (1,031,043)

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micro-supercapacitors, reduced graphene oxide, flexible electrodes, direct printing, intense pulsed white light

4.

Prediction of Fatigue Life of Semiconductor Package Under Thermal Cycling: Combined Effect of Package Design and Solder Materials

Number of pages: 34 Posted: 14 Feb 2025
Heon-Su Kim, You-Gwon Kim, Dong-Min Jang, Jin-Woo Jang, Seung-Yeong Lee and Hak-Sung Kim
Hanyang University, Hanyang University, affiliation not provided to SSRN, affiliation not provided to SSRN, affiliation not provided to SSRN and Hanyang University
Downloads 41 (1,183,237)
Citation 1

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Solder, Copper, Reliability, Crack type, Fatigue life, Thermal cycling

5.

Electron Density Measurement of Single and Mixed Gas in Inductively Coupled Plasma (ICP) Using Terahertz Time Domain Spectroscopy

Number of pages: 11 Posted: 28 Nov 2023
Dong-Woon Park, Heon-Su Kim, Sang-Il Kim and Hak-Sung Kim
Hanyang University, Hanyang University, Hanyang University and Hanyang University
Downloads 33 (1,277,121)

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diagnosis, inductively coupled plasma, plasma, terahertz radiation, electron density

6.

Measurement of Interfacial Adhesion Strength of Copper-Silicon Based Dielectric Interfaces Via Laser Spallation Test

Number of pages: 18 Posted: 03 Apr 2025
Young-Min Ju, Dukyong Kim, Se-Min Lee, Heuisu Kim, Daewoong Lee, Yeon-Taek Hwang, Seung Hwan Lee and Hak-Sung Kim
Hanyang University, Hanyang University, Hanyang University, Hanyang University, SK hynix Inc, SK hynix Inc, Hanyang University and Hanyang University
Downloads 28 (1,359,097)

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Laser spallation test, multi-level metallization, dielectric layer, interfacial strength, delamination

7.

A Unified Approach for Characterizing Fatigue Parameters of SAC305 Solder Joints using a Multi-DNP Specimen under Thermal Cycling

Number of pages: 33 Posted: 16 Jun 2026
You-Gwon Kim, Dong-Hoon YOO, Hyeong-Bin Park, Min Seo and Hak-Sung Kim
Hanyang University, Hanyang University, Hanyang University, affiliation not provided to SSRN and Hanyang University
Downloads 11

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Multi DNP, Thermal cycling fatigue, Energy-based parameter, Morrow fatigue model, Solder joint reliability