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Yeon-Taek Hwang

SK hynix Inc

Icheon

Korea, Republic of

SCHOLARLY PAPERS

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Scholarly Papers (1)

1.

Measurement of Interfacial Adhesion Strength of Copper-Silicon Based Dielectric Interfaces Via Laser Spallation Test

Number of pages: 18 Posted: 03 Apr 2025
Hanyang University, Hanyang University, Hanyang University, Hanyang University, SK hynix Inc, SK hynix Inc, Hanyang University and Hanyang University
Downloads 28 (1,359,097)

Abstract:

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Laser spallation test, multi-level metallization, dielectric layer, interfacial strength, delamination