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Jae Pil Jung

University of Seoul

Seoul

Korea, Republic of (South Korea)

  • University of Seoul

SCHOLARLY PAPERS

4

DOWNLOADS

188

TOTAL CITATIONS

0

Scholarly Papers (4)

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1.

Pulse Periodic Reverse Electro-filling of Through-Glass Via and Shear Strength Reliability for MEMS Interposers

Downloads 85 (771,553)

Pulse Periodic Reverse Electro-filling of Through-Glass Via and Shear Strength Reliability for MEMS Interposers

Number of pages: 21 Posted: 30 Jan 2026
Chul-Hwa Jung, Ashutosh Sharma, Jae Pil Jung and Hyunsik Kim
University of Seoul, Ajou University, University of Seoul and University of Seoul
Downloads 64 (938,792)

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TGV, glass, interposer, shear, MEMS, electroplating

Pulse Periodic Reverse Electro-filling of Through-Glass Via and Shear Strength Reliability for MEMS Interposers

Number of pages: 21 Posted: 02 Mar 2026
Chul-Hwa Jung, Ashutosh Sharma, Jae Pil Jung and Hyunsik Kim
University of Seoul, Ajou University, University of Seoul and University of Seoul
Downloads 21 (1,486,852)

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TGV, glass, interposer, shear, MEMS, electroplating

2.

Microstructure and IMC growth Kinetics in SAC305/ENIG Joints Prepared via Laser Solder Ball Jetting and Multiple Reflow Cycles

Number of pages: 16 Posted: 29 Sep 2025
Seungchan Ka, Deborah Bae, Ashutosh Sharma, Jae Pil Jung and Hyunsik Kim
University of Seoul, University of Seoul, Ajou University, University of Seoul and University of Seoul
Downloads 44 (1,132,890)

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Laser jetting, solder, imc, reflow, Interface, Shear

3.

Effect of Laser Beam Power on Microstructure Evolution and Interface Kinetics of Laser-Soldered Mini-Leds for Mems Packaging

Number of pages: 24 Posted: 11 Mar 2025
Jun Ho Ku, Hyun Sik Kim, Ashutosh Sharma and Jae Pil Jung
University of Seoul, University of Seoul, Ajou University and University of Seoul
Downloads 38 (1,208,973)

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Laser soldering, LED, Display, thermal, aging, microelectronic joints

4.

Nano-Tungsten-Modified Sn–Bi Alloys for Low-Temperature, High-Reliability Microelectronic Interconnects

Number of pages: 21 Posted: 16 Sep 2025
Jaeyeon Yi, Jiwan Kang, Sri Harini Rajendran, Jae Pil Jung, Ashutosh Sharma and Hyunsik Kim
University of Seoul, University of Seoul, University of Seoul, University of Seoul, Ajou University and University of Seoul
Downloads 21 (1,435,836)

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Sn-57Bi, W, solder, low temperature solder, Flexible electronics